Close Menu
TechTimes VietnamTechTimes Vietnam
  • News
  • Digital Life
  • Business
  • Tip & Trick
  • Science

Đăng ký bản tin

Cập nhật thông tin, đánh giá, bình luận... trong hộp thư email.

Facebook X (Twitter) Instagram YouTube LinkedIn TikTok RSS
Facebook X (Twitter) TikTok LinkedIn RSS
TechTimes VietnamTechTimes Vietnam
  • News
  • Digital Life
  • Business
  • Tip & Trick
  • Science
TechTimes VietnamTechTimes Vietnam
Inside TSMC’s Taichung Zero Waste Manufacturing Center: Closing the Loop in Semiconductor Production

Inside TSMC’s Taichung Zero Waste Manufacturing Center: Closing the Loop in Semiconductor Production

29/10/2025Đô Nguyễn6 Mins Read

As part of the APCER & Hotspot 2025 site visit program, participants toured TSMC’s Taichung Zero Waste Manufacturing Center — a model facility demonstrating how advanced recycling technologies are driving the semiconductor industry toward a circular and net-zero future.

Due to strict factory regulations, visitors were not allowed to bring any electronic devices into the facility. As a result, on-site photography was prohibited, and the available images for this article are limited to official or illustrative materials provided by TSMC.

The Taichung Zero Waste Manufacturing Center operated by TSMC stands as one of the most advanced recycling facilities in the global semiconductor industry. Built to handle and transform waste generated by TSMC’s wafer fabs in Taiwan’s Central Science Park, the center applies state-of-the-art treatment technologies to convert production waste into valuable materials. It houses four major recycling lines, each dedicated to a specific type of waste, ensuring that almost every byproduct can be purified and reused in manufacturing or sold for industrial applications.

HOT
⚡ Tin công nghệ nóng mỗi ngày tại TechWire.vn
Xem ngay →
Inside TSMC’s Taichung Zero Waste Manufacturing Center: Closing the Loop in Semiconductor Production

Fluoride Recycling

The fluoride recycling line focuses on recovering fluoride compounds from semiconductor waste streams and refining them for reuse. Waste liquids containing fluoride—such as hydrofluoric acid or various fluoride salts—are collected from wafer cleaning and etching processes. Through a combination of precipitation and membrane filtration, fluoride is separated from impurities and purified to electronic-grade standards. The refined material is then converted into high-value compounds such as calcium fluoride, which can be reused in wafer manufacturing or supplied to industries producing glass, ceramics, and specialty chemicals. Each batch undergoes rigorous quality testing to ensure it meets the strict purity levels required in semiconductor fabrication. This process not only reduces the amount of toxic fluoride discharged into the environment but also cuts the cost of purchasing new raw materials. During its trial phase from 2023 to 2024, this recycling line achieved full product utilization, proving both its environmental and economic effectiveness.

Silica Recycling

Another key operation at the center is the silica recycling line, designed to recover silica from industrial sludge and transform it into reusable materials. The sludge, produced during wastewater treatment and the chemical mechanical polishing (CMP) process, contains a significant amount of silica. By using advanced centrifugation and filtration systems, the silica is separated from other contaminants such as heavy metals and organic residues. It is then further purified through thermal and chemical treatments to achieve the high purity needed for electronic manufacturing or other industrial uses. The resulting recycled silica can be reintroduced into semiconductor production or sold to industries that manufacture cement, glass, or insulation materials. This process has allowed TSMC to virtually eliminate solid waste from its facilities in the Taichung Science Park and has significantly reduced the demand for mined silica sand — a resource that is becoming increasingly scarce worldwide.

Photo: Liao Yao-tung, Taipei Times
Photo: Liao Yao-tung, Taipei Times.

Solvent Thermal Recovery

The solvent thermal recovery line is responsible for recycling organic solvents used in wafer cleaning and photolithography. These solvents, including acetone and isopropyl alcohol (IPA), are recovered from waste gases and liquids generated during high-temperature processes. Through a thermal distillation system, solvents are separated from other substances while the heat energy produced from combustion is reused to power the distillation process itself. This closed-loop system enhances energy efficiency while minimizing waste. The recovered solvents are then purified through additional filtration and chemical processing to reach electronic-grade standards before being reintroduced into production or distributed to other industries such as coatings, printing, or chemicals. This technology helps reduce volatile organic compound (VOC) emissions, conserves energy, and strengthens the economic value of TSMC’s circular manufacturing approach.

Isopropanol Recovery

A separate isopropanol recovery line focuses specifically on reclaiming high-purity IPA from liquid waste. Isopropanol is an essential cleaning agent in semiconductor production, and the growing demand for advanced nodes such as 3-nanometer and 2-nanometer chips has made IPA recycling increasingly important. The waste liquid containing IPA is distilled in fractional columns to separate it from water and other impurities. Additional purification steps, including ion exchange and nanofiltration, ensure purity levels above 99.9 percent — matching electronic-grade requirements. Each batch is tested using gas chromatography before being reused in TSMC’s fabs or supplied to partners within the supply chain. By recovering and refining IPA, the company not only reduces chemical import costs but also prevents potential pollution from liquid waste, reinforcing its circular economy model.

A separate isopropanol recovery line focuses specifically on reclaiming high-purity IPA from liquid waste. Isopropanol is an essential cleaning agent in semiconductor production, and the growing demand for advanced nodes such as 3-nanometer and 2-nanometer chips has made IPA recycling increasingly important. The waste liquid containing IPA is distilled in fractional columns to separate it from water and other impurities. Additional purification steps, including ion exchange and nanofiltration, ensure purity levels above 99.9 percent — matching electronic-grade requirements. Each batch is tested using gas chromatography before being reused in TSMC’s fabs or supplied to partners within the supply chain. By recovering and refining IPA, the company not only reduces chemical import costs but also prevents potential pollution from liquid waste, reinforcing its circular economy model.

Supporting Systems and Integration

Complementing these four major recycling lines are several integrated sustainability systems that enhance the center’s overall performance. A rainwater collection and treatment system enables the recovery of up to two million cubic meters of groundwater annually, which can be reused for cooling or industrial processes. Solar panels installed on the rooftop provide part of the facility’s energy demand, cutting electricity-related carbon emissions. Additionally, TSMC is implementing a Polaris membrane-based carbon capture technology, scheduled for completion by the end of 2025. This system will extract carbon dioxide from flue gases for reuse or safe storage, with an expected reduction of approximately 40,000 tons of CO₂ equivalent per year.

Environmental and Economic Benefits

At full capacity, the Taichung Zero Waste Manufacturing Center processes more than 85 percent of the waste generated by TSMC’s fabs in the Central Taiwan Science Park, equivalent to around 130,000 tons annually. Every output from its recycling operations meets commercial or industrial reuse standards, resulting in a 100-percent product recovery rate. According to TSMC’s environmental profit and loss analysis, the facility helps save an estimated NT$1.5 billion (about USD 46 million) in environmental costs each year, while easing the burden on landfills and conserving natural resources.

Challenges and Innovation

Developing high-purity recycling processes for electronic-grade materials poses significant technical and financial challenges. The complexity of semiconductor waste requires the integration of multiple treatment methods — including distillation, chemical separation, and membrane filtration — and close collaboration with technology partners. To overcome these challenges, TSMC has teamed up with companies such as Chang Chun Petrochemical and Transcene to co-develop advanced nano-filtration and high-efficiency distillation systems. The introduction of the Polaris carbon capture technology further demonstrates TSMC’s commitment to innovation, as it not only lowers emissions but also creates new opportunities for reusing captured CO₂ in industrial applications.

The delegation poses for a group photo outside TSMC’s Taichung Zero Waste Manufacturing Center.
The delegation poses for a group photo outside TSMC’s Taichung Zero Waste Manufacturing Center.

Conclusion

The Taichung Zero Waste Manufacturing Center embodies TSMC’s vision of combining technological excellence with environmental responsibility. By recycling fluoride, silica, solvents, and isopropanol to high-purity standards, the company has established a circular model for semiconductor manufacturing that reduces waste, conserves resources, and strengthens supply resilience. Supported by renewable energy, water recovery, and carbon capture systems, the facility positions TSMC as a global leader in sustainable manufacturing — advancing the industry toward a truly zero-waste and net-zero future.


Nguồn: TSMC

https://www.tsmc.com/english

Follow TechTimes on Google News
Share. Copy Link Facebook Twitter Pinterest LinkedIn Tumblr Email WhatsApp
Previous ArticleAdvancing Circular Economy and Low-Carbon Supply Chains at APCER & Hotspot 2025
Next Article Canalys Forum APAC 2025: Asia–Pacific’s Channel Leaders Gather in Danang for Strategic Alignment

Related articles

Apple Raises AppleCare+ Pricing for New Mac and iPad Subscriptions

[COMPUTEX 2026] GTC Taipei 2026: Jensen Huang Unveils NVIDIA’s Vision for the Agentic AI Era

iOS 27 Rumored to Bring Major Camera and Photos App Upgrades

Microsoft Finally Brings Movable Taskbar Back to Windows 11

Largest Brain-Scan Study Links Anxiety Disorders to Lower Choline Levels

NVIDIA Introduces Open “Ising” AI Models to Push Quantum Computing Toward Real-World Applications

TECHTIMES TECH TRENDS LIVE
AI • Quantum Computing • Semiconductor • Future Tech
    © TechTimes.vn | Global Tech Trends
    Google
    Add as a preferred source on Google
    • Facebook
    • Twitter
    • Instagram
    • YouTube
    • LinkedIn
    • TikTok
    Latest News
    • LG Reports Record Q2 2026 Results, First-Half Operating Profit Surpasses Full-Year 2025
    • Apple Raises AppleCare+ Pricing for New Mac and iPad Subscriptions
    • Why Vietnam Is Emerging as a Strategic Hub for Advanced Thermal Manufacturing
    • [COMPUTEX 2026] GTC Taipei 2026: Jensen Huang Unveils NVIDIA’s Vision for the Agentic AI Era
    • HCA Chairman at COMPUTEX 2026: Vietnam’s Competitive Edge in AI Lies in Local Data
    You May Like

    Clicks Debuts Power Keyboard, a Pocket Keyboard Designed

    02/01/2026

    LONDON, Jan. 02, 2026 (GLOBE NEWSWIRE) — Clicks Technology today announced Clicks Power Keyboard, a…

    Lynq Launches RavenTalk at SHOT Show, Redefining Secure,

    20/01/2026

    LAS VEGAS, Jan. 20, 2026 (GLOBE NEWSWIRE) — Lynq Networks, a leader in local team…

    Concluding 2025 with a Strong Cash

    11/02/2026

    Ra’anana, Israel, Feb. 11, 2026 (GLOBE NEWSWIRE) — Rail Vision Ltd. (Nasdaq: RVSN) (“Rail Vision”…

    APCER & Hotspot 2025: Advancing Circular Economy in Asia Pacific through Digital Product Passports and Collaborative Supply Chains

    22/10/2025

    Leading industry voices at APCER & Hotspot 2025 highlight how Digital Product Passports and cross-industry…

    Perceptyx Acquires Lyceum AI to Close the Gap Between

    03/03/2026

    TEMECULA, Calif., March 03, 2026 (GLOBE NEWSWIRE) — Perceptyx, ​​the AI company for employee experience,…

    GTC 2026: NVIDIA Expands Its Vision from AI Chips to the Infrastructure of the AI Agent and Robotics Era

    17/03/2026

    At NVIDIA GTC 2026, Jensen Huang outlined how NVIDIA is building the foundation for the…

    Google Begins Rolling Out Refreshed Workspace Icons Ahead of I/O 2026

    19/05/2026

    Google is introducing redesigned Workspace app icons with gradient styling and cleaner visuals, signaling a…

    TAITRONICS & AIoT Taiwan 2025 Highlights: Taiwan Showcases Next-Gen AIoT Innovations

    23/10/2025

    From AI-powered robotics to edge computing and smart mobility platforms, TAITRONICS & AIoT Taiwan 2025…

    CableLabs and Zoom Showcase AI-Driven Framework Designed to Enhance Network and App Performance

    24/03/2026

    LOUISVILLE, Colo., March 24, 2026 (GLOBE NEWSWIRE) — CableLabs today announced the successful completion of…

    Taiwan Launches “Go Healthy with Taiwan” Global Challenge to Inspire Innovative Healthcare Solutions

    03/06/2025

    The “Go Healthy with Taiwan” initiative invites global participants to propose innovative ideas that combine…

    Base44 to Air its First Super Bowl Ad

    28/01/2026

    Base44 brings vibe-coding app creation to the biggest advertising stage NEW YORK – Base44, the…

    Opti9 Appoints TJ Houske as President & General Manager of

    03/03/2026

    GARDEN CITY, N.Y., March 03, 2026 (GLOBE NEWSWIRE) — Opti9, a leading hybrid cloud solutions…

    DMCA.com Protection Status DMCA Compliance Information
    TechTimes Vietnam
    Facebook X (Twitter) Instagram YouTube LinkedIn TikTok
    • News
    • Digital Life
    • Business
    • Tip & Trick
    • Science
    TechTimes is a general electronic information portal; Governing body: TechTimes Company Limited; Address: 39/8A Street 475, Quarter 41, Phuoc Long Ward, Ho Chi Minh City; Person responsible for content: Mr. NGUYEN VAN DO; License: General electronic information portal license No. 39/GP-STTTT issued by the Ho Chi Minh City Department of Information and Communications on August 21, 2017; Supplementary license No. 23/GP-STTTT issued on March 23, 2021 and update decision No. 03/QĐ-STTTT-ICP issued by the Department of Information and Communications on March 1, 2024.

    © 2026 TechTimes.vn - Continuously updating news, product reviews, sharing experiences in using high-tech products, insights and analysis from reputable experts - Email: info@techtimes.vn , Phone: 0935014085• Powered by vHost

    Type above and press Enter to search. Press Esc to cancel.